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  power f-mos fets 2SK2339 2SK2339 silicon n-channel power f-mos n features l avalanche energy capability guaranteed l low on-resistance l no secondary breakdown l low-voltage drive n applications l non-contact relay l solenoid drive l motor drive l control equipment l switching mode regulator n absolute maximum ratings (tc = 25?c) parameter drain-source breakdown voltage gate-source voltage drain current dc pulse avalanche energy capability allowable power t c = 25?c dissipation ta= 25?c channel temperature storage temperature symbol v dss v gss i d i dp eas * p d t ch t stg rating 8010 15 10 20 62.5 30 1.3 150 C55 to +150 unit v v a a mj w ?c ?c n electrical characteristics (tc = 25?c) parameter drain-source cut-off current gate-source leakage current drain-source breakdown voltage gate threshold voltage drain-source on-resistance forward transadmittance diode forward voltage reverse recovery time reverse recovery charge input capacitance output capacitance feedback capacitance turn-on time fall time turn-off time (delay time) channel-case heat resistance channel-atmosphere heat resistance symbol i dss i gss v dss v th r ds(on) 1 r ds(on) 2 | y fs | v dsf t rr q rr c iss c oss c rss t on t f t d(off) r th(ch-c) r th(ch-a) condition v ds = 70v, v gs = 0 v ds = 0, v gs =15v i d =1ma, v gs = 0 v ds =10v, i d =1ma v gs =10v, i d = 5a v gs = 4v, i d = 5a v ds =10v, i d = 5a i dr =10a, v gs = 0 l=230 h, v dd = 30v, v gs = 0 i dr =10a, di/dt= 80a/ s v ds =10v, v gs = 0, f= 1mhz v dd = 30v, i d = 5a v gs =10v, r l = 6 w min 70 1 3 typ 150 230 5.5 0.55 2.2 85 250 20 0.5 0.9 1.9 max 10 10 90 2.5 230 370 C1.8 4.2 96 unit a a v v m w m w s v s s pf pf pf s s s ?c/w ?c/w unit : mm 1 : gate 2 : collector 3 : emitter n type package * l= 5mh, i l = 5a, 1 pulse n equivalent circuit 8.5 0.2 6.0 0.5 10.0 0.3 10.5min. 2.0 1.5 0.1 1.5max. 0.8 0.1 5.08 0.5 2.54 0.3 1.1max. 0.5max. 1.0 0.1 3.4 0.3 2 13 g s d
r ds(on) C i d ias C l-load area of safe operation (aso) p d C ta i d Cv ds i d C v gs v th C t c r ds(on) C v gs | y fs | C i d power f-mos fets 2SK2339 0.1 0.1 1 10 100 0.5 5 50 0.3 3 30 0.2 2 20 110 0.5 5 0.3 3 l-load l ( mh ) abalanche current i as ( a ) t c =25?c 62.5mj 0 600 500 400 300 200 100 010 gate-source voltage v gs ( v ) drain-source on-resistance r ds (on) ( m ) 2468 t c =25?c i d =5a i d =2.5a drain-source voltage v ds ( v ) drain current i d ( a ) 0 14 12 10 8 6 4 2 024681012 3v v gs =10v t a =25?c 4v 5v 4.5v 3.5v p d =30w 0 1 2 3 4 5 6 7 010 8 6 4 212 drain current i d ( a ) forward transadmittance | y fs | ( s ) v ds =10v ta=25?c 0 100 200 300 400 500 600 024681012 drain current i d ( a ) drain-source on-resistance r ds(on) ( ) (1)v gs =4v (2)v gs =10v t c =25?c (1) (2) 18 16 14 12 10 8 6 4 2 0 0 246 10 8 gate-source voltage v gs ( v ) drain current i d ( a ) t c =25?c 0 10 20 30 40 50 60 0 40 80 120 160 20 60 100 140 ambient temperature ta ( ?c ) allowable power dissipation p d ( w ) (1) (2) (1) t c =ta (2) without heat sink (p d =1.3w) 0.1 1 1 10 0.3 3 30 100 10 550 3 30 100 drain-source voltage v ds ( v ) drain current i d ( a ) non repetitive pulse t c =25?c i dp dc i d t=100ms t=1ms t=10ms t=100ms 0 1 2 3 4 5 6 0 25 50 75 100 125 150 case temperature t c ( ?c ) gate threshold voltage v th ( v ) v ds =10v i d =1ma
c iss, c oss, c rss C v ds t d(off), t r, t on C i d v ds, v gs C q g power f-mos fets 2SK2339 i sd C v sd r th C t p 2000 0 100 20 40 60 80 1000 500 200 100 50 5 20 10 drain-source voltage v ds ( v ) f=1mhz t c =25?c input capacitance, output capacitance, c iss , c oss , c rss (p f ) feedback capacitance coss ciss crss 0.05 20 0 2.0 diode forward voltage v sd ( v ) souce-drain current i sd (a) 0.5 1.0 1.5 10 5 2 0.5 0.2 3 0.3 1 0.1 v gs =0 t c =25?c 0 3.0 2.5 2.0 1.5 1.0 0.5 024681012 drain current i d ( a ) switching time t ( ms ) v dd =30v v gs =10v t c =25?c t d(off) t f t on 0.1 1 10 100 1000 10 ? 10 ? 10 ? 10 ? 11010 2 10 3 10 4 pulse width t p ( s ) thermal resistance r th ( ?c/w ) (1) (2) notes: r th was measured at ta=25?c and under natural convection. (1) without heat sink (2) with a 50 50 2mm al heat sink 00 14 60 12 50 10 40 8 30 6 20 4 10 2 0 5 10 15 20 25 gate charge amount q g ( nc ) drain-source voltage v ds ( v ) gate-source voltage v gs ( v ) v gs v ds =30v v ds i d =10a ta=20?c v ds =40v v ds =50v
please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconductor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative character- istics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or gen- eral electronic equipment (such as office equipment, communications equipment, measuring in- struments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchas- ing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. 2001 mar


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